TC Wafer 

TC wafer can be made up for 48 TC points

Minimum distance from wafer's edge to TC Point is 2mm

Wafer

2", 4", 5", 6" 8", 12"

Type

K type(Accuracy:0.4% of reading) 

R type(0.25% of reading) 

S type(0.25% of reading)

TC wire Diameter

0.127mm

0.07mm

(For RTP process 0.07mm is recommendable)

Connector

Di sub Connector

Miniconnector etc..

Max temperature : 1,100℃

 Insulation material

: silica sleeve(max temp:850℃), 

micro quartz tube(max temp: 1,100℃),

Teflon (max temp: 250℃), 

ceramic sleeve, etc..

Lead time

2 weeks

Vacuum Feed through

Kapton tape will insulate and 

protect TC wire and Vacuum rate 

10 to-7 torrcan be available.

< Structure of TC Wafer >

● Wafer

- SI WAFER, SIO2 filmed Wafer, Cu filmed Wafer, TiTiN filmed Wafer

-GaAs wafer Sapphire wafer, Quartz wafer Glass wafer, etc

● Insulator

-Ceramic fiber (250~ 850C), Quartz(850~1200C)

-Teflon / Polymide(0~250C), Fiber glass(0~450)

● Connector

-Mini connector (Exellent accurancy), Pin connector

- D sub connector, banna plug, bare

● Hole

- The best hole processing idea to minimize heat loss

-User can measure the most accurate

temperature of wafer surface

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